Zinc and bismuth additives' impacts on the physical properties of lead-free alloys used in electronic appliances

Abstract

The goal of the current analysis was to analytically inspect how the addition of zinc and bismuth would alter the binary structure of the lead-free solder Sn-5Sb. Binary arrangement results have been stretched to the ternary arrangements Sn–5Sb–XBi or XZn (0 ≤ X ≤ 4wt.%) solder that were composed through rapid solidification processing (RSP) using the melt–spun method. The created phases were revealed through metallographic study of the formed alloys using XRD. High elastic modulus E = 32.5 GPa and good electrical resistivity = 26x10-8 .m are two characteristics of binary Sn-Sb doped with Bi. The alloy Sn–5Sb–4Zn owns the most practical characteristics as a candidate lead-free solder alloy. It has a higher Vickers hardness value, Hv, 260MPa, a lesser value of internal friction, Q-1 = 5.5x10-2, a reduced melting point, 221oC. The Sn-Sb binary system is appropriate for temperatures up to 8°C, which is a crucial characteristic for solder alloys.