article · 2023 17th International Conference on Ubiquitous Information Management and Communication (IMCOM)
We present in this paper a new modified version of the System-in-Package (SiP) model based on three-layer chips. The idea is to add copper layers permitting to take up its thermal dissipation and to investigate the thermal performance we have used Finite Element Method (FEM) analyses with COMSOL Multiphysics®. The temperature variation in the numerical simulation shows that the maximum temperature value is decreasing with a flat temperature distribution compared to the traditional model. Moreover, in terms of the thermal conduction performance, the thermal management of the system packaging, Chip-Cooling-Laminate-Chip (CCLC) is achieving high reliability and resolution with low-cost micro-devices especially for the micro-medicine applications, when the temperature maximum in the chips is reduced by 64%.
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DOI: 10.1109/imcom56909.2023.10035652
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