Evaluation Of The Thermal Management Efficiency Of a Heat Sink For Electronic Devices Under Transient Heat Flux Shock

Abstract

This paper examines the evaluation of thermal control performance of a heat sink designed for an electronic device subjected to transient heat flux shock. Its primary objective is to assess the efficacy of thermal management in mitigating the impact of sudden thermal shocks on electronic devices. Thermal control effectiveness is examined by minimizing peak temperatures, enhancing natural convection, optimizing heat transfer with ambient air, and ensuring overall temperature regulation efficiency. The findings indicate that employing a heat sink with triangular fins and phase change material leads to a reduction in maximum temperature by 10 K compared to a heat sink with rectangular fins. Achieving peak thermal efficiency is possible when the phase-altering substance envelops the triangular fins completely. With a combination of PCM and triangular fins, exceptional temperature control efficiency can be attained.