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Electrodeposition of Cu<sub>2</sub>NiSnS<sub>4</sub> absorber layer on FTO substrate for solar cell applications

202412 citationsOpen accessMohammed V University

Abstract

Potentiostatic and <i>in situ</i> electrochemical impedance spectroscopy (EIS) measurements were recorded to study the nucleation and growth mechanisms of electrodeposited Cu<sub>2</sub>NiSnS<sub>4</sub> (CNTS) thin films from aqueous solution at different applied potentials. The electrodeposition process of Cu-Ni-Sn-S precursors were studied using cyclic voltammetry and chronoamperometry techniques. The nucleation and growth mechanism of these films was found to follow a three-dimensional progressive nucleation limited by diffusion-controlled growth. The nucleation mechanism is found to be influenced by the presence of S<sub>2</sub>O<sub>3</sub> <sup>2-</sup>, which prompts the electrodeposition of S. <i>In situ</i> electrochemical impedance spectroscopy (EIS) investigates the electrodeposition behavior of CNTS precursors on the surface electrode. A capacitive behavior was observed at high frequencies, while the presence of Warburg diffusion was detected only for potentials less negative than -1.0 V <i>vs.</i> Ag/AgCl. The crystallographic structure, morphology, composition, and optical band gap of CNTS thin films was examined using X-ray diffraction, Raman spectroscopy, scanning electron microscopy, and UV-visible spectroscopy. Electrodeposition at -0.98 V <i>vs.</i> Ag/AgCl resulted in the formation of microsheets with a uniform morphology and homogeneous thickness of sulfurized CNTS film. This potential also proved to be optimal for achieving higher crystallinity, a pure phase, and a suitable band gap energy of approximately 1.6 eV.

Research topics

  • Chalcogenide Semiconductor Thin Films
  • Copper-based nanomaterials and applications
  • Electrodeposition and Electroless Coatings

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DOI: 10.1039/d4ra04249b

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