Efficiency of Heat Dissipation Utilizing Triply Periodic Minimal Surfaces (TPMS) with Emphasis on Flow Dynamics and Heat Transfer

Abstract

Heatsinks play a crucial role in ensuring the efficient operation of electronic devices and preventing potential failures. Additive manufacturing provides solutions for exploring and refining heatsink designs by enabling the creation of complex structures. Conversely, TPMS structures exhibit excellent thermophysical properties, suggesting superior heat dissipation solutions. This paper assesses the flow dynamics and heat transfer of a Neovius TPMS structure heatsink through parametric analysis, comparing its performance to that of a conventional pin-fin heatsink. The findings show that the TPMS-based heatsink significantly improves heat transfer compared to its traditional counterpart. This enhancement is attributed to the unique topological structure of TPMS, inducing greater fluid turbulence through continuous cyclic acceleration and deceleration in the flow direction, thus enhancing heat transfer.