article · Journal of Materials Science Materials in Electronics

Effects of trace addition of Fe on the thermal, microstructure, and tensile creep properties of Sn-0.7Cu eutectic alloy

Shereen M. Abdelaziz
A.F. Abd El-Rehim
H. Y. Zahran
M. Abd El-Hafez

20242 citationsAin Shams University

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Research topics

Electronic Packaging and Soldering Technologies
Aluminum Alloy Microstructure Properties
Intermetallics and Advanced Alloy Properties

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DOI: 10.1007/s10854-024-12478-8

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