Comprehensive Analysis and Thermo‐Economic Optimization of a Hybrid Phase Change Material‐Based Heat Sink for Electronics Cooling

Abstract

ABSTRACT The heat generated by electronic components (ECs) requires efficient thermal management to ensure safe and reliable operation. Phase change materials (PCMs) embedded in metal foam (MF) can enhance thermal conductivity but reduce natural convection within the PCM, limiting its heat storage capacity and increasing system cost. This study proposes a hybrid PCM‐based heat sink (HS) partially filled with aluminum MF at various height ratios (Ø = 0, 1/3, 2/3, and 1) to address these issues. Using the enthalpy‐porosity method and thermal equilibrium model, two‐dimensional transient simulations are performed in ANSYS FLUENT with n‐eicosane as the PCM. The results show that the PCM‐based HS effectively manages EC temperature, with performance and heat transfer improving as Ø increases. A filling ratio of Ø = 1 reduces the EC temperature by 16.3°C (38%) and the PCM melting time by 1163 s (13.85%) compared to an unfilled HS. However, Ø = 2/3 is found to be the optimal configuration, achieving a 33.82% reduction in EC temperature, a 12.67% higher performance enhancement, a 57.54% increase in thermal energy storage, and a 33.33% reduction in cost and system weight compared to Ø = 1. These findings demonstrate that partial MF filling optimizes the thermal and economic efficiency of PCM/MF composite‐based HSs.