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Atomistic Behavior of Deformed Au Thin Film during the Indentation Process

Abstract

In this study, we investigate the mechanical properties of gold (Au) materials using molecular dynamics simulations. In this simulation, the nanoindentation process was performed to analyze the deformation defects and hardness properties of Au under different indentation velocities. The results suggest that the deformation behavior of the Au specimen was affected by different indentation velocities. These findings were confirmed by examining the load-displacement curve, which indicated elastic deformation through the appearance of a linear load-displacement relationship at low indentation velocities. In contrast, plastic deformation was identified by the presence of intensified serrations in the load-displacement curve at higher indentation velocities. Under such conditions, the hardness exhibited minimal variation when the indenter velocity increased from 5 mls to 10 mls. However, a significant increase in hardness was noted when the indentation velocity was further raised to 15 mls.

Research topics

  • Metal and Thin Film Mechanics
  • Copper Interconnects and Reliability
  • Microstructure and mechanical properties

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DOI: 10.1109/iraset60544.2024.10549163

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